Application of PUR hot melt adhesive
PUR hot melt adhesive due to its excellent performance, products are developed and applied in various fields. (1) When binding books wirelessly, the cured adhesive layer has good flexibility, and the flatness is high when the book is turned over and opened, and the adhesive layer can be prevented from breaking when fully opened, which is better than EVA adhesive bound books;
PUR hot melt adhesiveDue to its excellent performance, the products are developed and applied in various fields.
(1) When binding books wirelessly, the cured adhesive layer has good flexibility, and the flatness is high when the book is turned over and opened, and the adhesive layer can be prevented from breaking when fully opened, which is better than EVA adhesive bound books;
(2) In the daily necessities industry such as shoes and clothing, PUR hot melt adhesive shows good adjustability, flexibility, adhesion, breathability and other properties;
(3) wood and board bonding, PUR hot melt adhesive can fully react with the moisture in the wood, excellent bonding performance, good aging resistance, so as to ensure that the bonding site lasting firm;
(4) automotive industry, automotive interior plastics, lights and other parts of the bonding, glass bonding, etc.;
(5) Electronic industry
The traditional bonding methods in electronic products mainly include ultrasonic welding, insert molding, mechanical fastening, tape bonding and adhesive bonding. From computers, electronic instruments, communication equipment and other electronic instruments, to transistors, printed circuit boards, integrated circuits and other semiconductor devices, electronic industry adhesives have become an independent special type of adhesive, used in various fields of the electronics industry.
Electronic glue has the advantages of good appearance, wide application base material, uniform stress distribution, light weight and low cost. This is an important development trend of electronic component bonding in the future.
At present, PUR hot melt adhesive is widely used in the electronics industry. PUR hot melt adhesive has the characteristics of solvent-free, good fluidity, high dispensing efficiency, one-component dispensing, rapid curing of the adhesive layer, low thermal shrinkage, low density, uniform stress transmission, and easy adjustment of opening time. At the same time, it also shows good bonding strength to metal materials such as stainless steel and aluminum, ABS, PC, glass and other materials. When used as a structural adhesive, it is especially suitable for the electronic industry assembly line that requires miniaturization, light weight and high efficiency.
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